iPhone 7 Alleged Motherboard Shown In Pictures With SoC

The motherboard showing diverse components of the upcoming iPhone 7 accept been leaked, along with the powerful, and efficient A10 chipset. Let us take a wait at the leaked motherboard images and run into if you lot tin can identify the other images shown in the pictures given below.

Apple A10 Shown On The iPhone 7 Motherboard – Let'southward See If Yous Can Place All The Details Correct Here

Apple's A10 is going to be manufactured on TSMC's 16nm FinFET technology, which is the same node that's going to be used for the upcoming Apple Watch 2. In the images, we tin just see a single SIM menu slot, and that debunks the rumor that the smartphone is going to come with a dual SIM feature.

From a hardware perspective, all upcoming iPhone 7 models are going to feature an A10 SoC, and according to the leaked operation metrics, the chipset is powerful, but not as much equally we would want information technology to be, although we have to add that the improved processor pattern will help to salve battery life. The phone could also characteristic LTE modems from two unlike companies, and we believe that the phablet is going to characteristic a iii,100mAh battery.

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Apple is also said to adopt a new bit developing technology chosen FoWLP, which stands for fan-out wafer level packaging platform. With this technology, smartphone OEMs can profoundly reduce the thickness of their mobile devices since FoWLP does not require a PCB. Additionally, it is able to increase the efficiency of chips by 30 percentage and reduce the thickness of smartphones by at least 0.3mm. We bet Apple's ears must be ringing when they were pitched that smartphone thickness could be using by employing this technology in mobile devices.

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